iPhone 5S Internal Components Revealed In Leaked Photo
Last week, right after Apple revealed their plans regarding the upcoming iOS 7, chatters and rumors related to the future iPhone started to pop everywhere online. A new leaked photo is now surfacing the web, after it first appeared on a Japanese electronics site, and it allegedly pictures the logic board Apple is going to use in their upcoming iPhone. And, while we’re not surprised, the board looks pretty much alike the internal hardware of an iPhone 5. There are a few differences, but you can barely notice them. In another order of ideas, now we are a little closer to the rumors which claimed that Apple’s new iPhone will only have slight changes and not a completely different design.
If you put this picture side by side with the logic board of a current iPhone 5, you can barely see the differences. Besides the minor changes in the shape of the electronics and a few different screw locations, the boards look almost the same. As you know, there have been some rumors which claimed that Apple is thinking about re-scaling the device so that it would fit in the tablet series. However, by looking at this piece of information we realize that the drastic appearance shift of the iPhone many have been waiting for, is not going to be seen in this device.
Otherwise, the logic board seen in the picture could be manufactured for the low-end iPhone which has been overly discussed in the past weeks. While the iPhone 5S might be seeing a more radical design shift, the cheap iPhone might only have minor adjustments in the internal hardware. Even if the leaked image is the actual logic board that will be used in one of Apple’s next devices, it is too early for us to realize how the component will be used. For instance, even if Apple made the board, it could belong to a simple prototype.
As you know, the two smartphone manufacturer giants Apple and Samsung are ready to eat off each other, so we might have some reasons to worry here. As you know, Samsung has been manufacturing Apple’s chips by now, and it seems that this awkward relationship will reflect in the quality and power of the next iPhone device. It might be possible to not even get to see, by the end of this year, one of Apple’s A SoC processor. Sources claim that TSMC (Taiwan Semiconductor Manufacturing Company) is handling the manufacturing of the A6x processor for the next iOS devices, however we don’t believe that the 20nm A7 will get to the iOS devices before 2014.
However, if Apple’s next iPhone won’t be seeing a huge revamp as rumored so far, then it is easy to assume that the logic board belongs to that model. But this means bad news for Apple, as the value of the stock price will fall. A good strategy for Apple would be to keep stalling the iPhone 5S until they could make the revamp, while they regain the first place on the smartphone market with the release of the low-end iPhone, also referred to as the iPhone mini.
